Power Optimization by Repeater Insertion with Thermal-Electric Coupling Effects

To improve the power and temperature characteristics of IC,a power optimization method by repeater insertion is presented in this paper. It is based on the electro-thermal coupling among power,delay and temperature,includes delay model,power model and thermal model,and makes power consumption reduced by allowing a small delay penalty. The proposed method contains temperature impacts on delay and power,and takes inductance effect into consideration. The optimized results are gained by using Matlab software. Simulations for repeater insertion under 65 nm and 45 nm technology are carried out and the results show that the chip temperature and power optimized by the proposed method are decreased dramatically. In addition,this paper points out that absence of inductance effect leads to underestimate optimal temperature and power.