A New Approach to 3D Parasitic Capacitance Extraction of Interconnects with Building Blocks of Dielectric

A novel concept of Building Block of Dielectric is introduced to facilitate preprocessing the 3D interconnect structure and building a library of BBD for fast capacitance extraction. With a process description file it can handle complex structure as conformal and non-orthogonal wire. Numerical results present that the capacitance extraction algorithm based on BBD is at least 30times faster than SpiceLink without loss of precision.