3D互连电容快速提取的新途径——介质积木库法

A New Approach to 3D Parasitic Capacitance Extraction of Interconnects with Building Blocks of Dielectric

摘要: 引入介质积木的概念,可方便地对三维互连结构作预处理以形成介质积木库,从而提高电容提取速度.介质积木库法只需借助工艺描述文件,即可处理包括保形介质和非正交互连等复杂结构.数值计算表明:基于介质积木库的电容提取算法在同等精度下比SpiceLink算法快30倍以上.

Abstract: A novel concept of Building Block of Dielectric is introduced to facilitate preprocessing the 3D interconnect structure and building a library of BBD for fast capacitance extraction. With a process description file it can handle complex structure as conformal and non-orthogonal wire. Numerical results present that the capacitance extraction algorithm based on BBD is at least 30times faster than SpiceLink without loss of precision.