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树状结构多芯片组件互连网络延迟的研究

STUDIES ON THE DELAY IN TREE-STRUCTURED MCM INTERCONNECTION NETWORKS

  • 摘要: 在多芯片组件互连传输线的电路模型中,必须同时考虑线电感和线电阻,因此其互连延迟的研究比传统的PCB和IC互连更具复杂性.研究了具有树状拓扑结构的MCM互连网络的延迟:在明确了MCM互连延迟的独特点后,着重给出了树状结构互连网络冲激响应的矩的求法,从矩与延迟的密切关系中给出了求延迟的一种有效方法.

     

    Abstract: In the circuit model of interconnection transmission line for MultiChip Modules,it is necessary to take into account the effects of both line inductance and line resistance.The analysis of MCMs is more comprehensive than that of traditional PCBs and ICs.This paper provides a new method to study on the delay in tree-structured MCM Interconnection Networks.Firstly,it demonstrates the properties of delay in MCM circuit.Secondly,It investigates the expressions of the first several moments of tree-structured interconnection networks.Lastly,from the close relation between the moments and delay,an actual approach is presented.

     

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