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双层布线的受限通孔最小化问题

THE CONSTRAINED VIA MINIMIZATION PROBLEM FOR TWO-LAYER ROUTING

  • 摘要: 本文提出了一种双层VLSI及PCB布线的受限通孔最小化问题的新方法。该方法允许通孔候选点所关联的线网段的数目任意多个,且与初始布线所采用的线网连接方式无关。

     

    Abstract: A new approdach to the constrained via minimization problem for two-layer routing is proposed. This approach is Suitable for any type of gridbased routing. Arbitrary number of wires is allowed to intersect at a via candidate.

     

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